Technological Competence
FST has had many years of experience and practice with
simulations in the following areas:
- Double-sided lithography
- High-precision, anisotropic sinc-function structuring
- Special processes such as anodic bonding (silicon-glass)
and silicon direct bonding (silicon-silicon) - Special sawing processes
- PCB/ceramic (SMT, COB) equipment in connection with pressure
sensor circuits - Calibration (pressure, temperaturer)
