Once they have been connected to the configuration, the chips can be protected from mechanical and environmental influences by means of potting and encapsulation. The potting materials are adapted to the requirement profile in question (operating temperatures, thermal mismatch, transparency of the potting). To protect the electronics from humidity, part or all of the surface of the assemblies can be coated with thin, organic materials (e.g. parylene or HumiSeal®). This can also help to increase the insulation of the components and assemblies. If required, discrete components, individual sub-modules or complete assemblies can be hermetically sealed to achieve a defined atmosphere (dew point < -65 °C) within the sealed-off area. This can be done by soldering with metallic or glass-based solders or by means of resistance welding under defined atmospheric conditions.
DCB-based, injection-molded, high-current switch module for drive electronics
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