First Sensor Microelectronic Packaging GmbH (formerly Microelectronic Packaging Dresden GmbH) in Dresden-Klotzsche has many years of experience and extensive expertise in developing and manufacturing everything from electronic micro systems for components to micro systems in the form of complex multi-chip modules for the customized miniaturization of optoelectronic and MEMS-based sensors. In ISO class 8 to 5 clean rooms, we manufacture semiconductor chips using the latest automated installation and connection technology methods. In addition to prototypes and small batches, this location also produces unit volumes in the millions and is certified in accordance with the ISO/TS 16949 and ISO 14001 quality management systems. The company possesses special skills in the processing of optical sensors, the assembly of large chips (> 10 x 10 cm) as well as the processing of chips with TSV technologies.
The Berlin-Weißensee location (formerly ELBAU) focuses on the development and production of electronic micro systems for pressure, flow and optical sensors. Here we develop highly complex system designs and prepare them for series production. With this comprehensive expertise along the value chain, we are able to offer both individual sensor solutions and optimized standard products and services. The location uses the latest micro system technologies and automatic system technology under clean room conditions to ensure optimal, production-ready product design. Our products are used in medical technology, industrial automation, in the aerospace industry, building services engineering, camera technology and in the offshore sector.
First Sensor Lewicki GmbH (formerly LEWICKI microelectronic GmbH) in Oberdischingen, Ulm has been a specialist in hybrid circuits and complex electronic modules for over 40 years. Our hybrid circuits, components and electronic modules from Oberdischingen have become synonymous with reliability and are used worldwide in power electronics, sensor systems, medical technology and in the aerospace industry. In addition to thick film technology, our range of technologies also encompass all microelectronic installation and connecting technologies. The location includes a production area with a continuously monitored clean room of over 1,800 square meters. Qualifications and screening, in accordance with MIL and ESA standards for example, are carried out using our in-house pool of equipment. First Sensor Lewicki GmbH also meets aerospace industry requirements according to DIN EN 9100 and medical technology requirements according to DIN EN ISO 13485.