The European Union supports innovative research and development projects of First Sensor with funds from the European Regional Development Fund (ERDF). These include the research and development project "Highly Integrated Optical Detectors by Means of 3D Integration Technologies". The project is carried out in cooperation between First Sensor AG and the Fraunhofer Institute for Reliability and Microintegration (FhG IZM).
The project is divided into two sub-projects. In the first sub-project First Sensor develops 3D optical detectors for professional system solutions. In the second sub-project the FhG IZM investigates the development of a 3D sensor packaging at the wafer level.
The aim of the overall project is to investigate the potential of 3D integration at the wafer level for the production of customized sensor solutions for small (some thousands) to medium (several million) quantities in order to perspectively keep the cost of production and the form factor in this area competitive. Often, solutions that meet the current requirements can be found in the area of wafer level packaging. In applications where CMOS based, optoelectronic integrated circuits are increasingly used, their occasional disadvantages may be encountered by a stacked two-chip solution (3D integration). For this, through-silicon vias (TSVs) are necessary.
This research and development project has a term of three years (starting in June 2015) and is sponsored by the European Union as part of the program to promote research, innovation and technologies (ProFIT) by using funds from the European Regional Development Fund and from the state of Berlin.