Cleanroom-First-Sensor
Research and Development
Innovation is crucial to our success as a technological company.

Funded projects

The European Union supports innovative research and development projects of First Sensor with funds from the European Regional Development Fund.



A current research and development project is entitled "Packaging and assembly technology for optical sensors for use in autonomous driving and industry 4.0". The project started on June 1, 2019 and will end on May 31, 2021, with the support of the Sächsischen Aufbaubank. The total cost of the project is 1.6 million Euro.

In addition to First Sensor AG, which is responsible for the technology and design development for LiDAR sensors, three other partners are involved in the project: 1. viimagic GmbH is responsible for technology and design development for image sensors, 2. MSG Lithoglas GmbH, is responsible for the development of a bonding technology to directly cover optical chips with glass windows, and 3. Technische Universität Dresden, Institute of Electronic Packaging Technology (IAVT) is responsible for the investigation of a 3D stereolithography process as an encapsulation technology.

Usually, ceramic housings with glass lids are used as hermetic packages for the assembly of automotive LiDAR and image sensors. However, the disadvantages of this technology are:

  • High risk of contamination during assembly
  • Long bond wires cause parasitic effects
  • Miniaturization of the overall assembly is limited by the size of the ceramic packages
  • Limitation of thermal management within the housing
  • High material costs

Packaging technologies based on printed circuit boards are much more cost-effective, but not hermetic and unsuitable for the high reliability requirements typical of the automotive industry. In particular, diffusing moisture in combination with operating voltage leads to corrosion effects on the chip surface and ultimately to the destruction of the sensor.

The project goal is therefore the development of a new automotive-suited COB housing technology for LiDAR multi-channel and image sensors based on laminate substrates. Filter glasses are to be mounted on the sensor surface directly on the sensor chip using adhesive technologies. The assembly process to be developed will be carried out at wafer or chip level. As a result, the entire assembly will be encapsulated with low stress using an innovative 3D housing technology and newly developed, adapted materials.

Your contact person at First Sensor is Markus Braunschweig, E-mail: markus.braunschweig@first-sensor.com, Phone: +49 351 2136-020.
Company
First Sensor is one of the world's leading suppliers in the field of sensor systems and part of TE Connectivity. In the growth market of sensor systems, First Sensor develops and produces customer-specific solutions for the ever-increasing number of applications in the industrial, medical, and mobility target markets. Our goal here is to identify, meet and solve the challenges of the future with our innovative sensor solutions early on.
Investor Relations
Our investor relations activities aim at raising the international publicity of First Sensor AG and at consolidating and extending the perception of our share as an attractive growth stock. This means we keep our online communication transparent, comprehensive and continuous in order to enhance your trust in our share.
Tailored Solutions
In the growth market of sensor systems, First Sensor develops and produces customer-specific sensors, electronics, modules and complex systems for the ever-increasing number of applications in the industrial, medical, and mobility target markets. As a solution provider the company offers complete development services from a first draft and proof of concept up to the development of prototypes and finally serial production. First Sensor offers comprehensive development expertise, state-of-the-art packaging technologies and production capacities in clean rooms from ISO class 8 to 5.
Competencies
In the growth market of sensor systems, First Sensor develops and produces customer-specific sensors, electronics, modules and complex systems for the ever-increasing number of applications in the industrial, medical, and mobility target markets. As a solution provider the company offers complete development services from a first draft and proof of concept up to the development of prototypes and finally serial production. First Sensor offers comprehensive development expertise, state-of-the-art packaging technologies and production capacities in clean rooms from ISO class 8 to 5.
Career
Innovation, excellence, proximity – these are our values, our ambition, our drive. Anything less is not an option. Our sensor solutions stand for technical innovation and economic growth. As such, they form the basis for the development and application of new technologies in almost all areas of life. We aim to shape this future together with you.

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