Encapsulation

Encapsulation describes the process of isolating an object from its environment. The purpose of encapsulation is to protect components from environmental and mechanical influences and to enhance their operational reliability. Chips and wire bonds may be covered either fully or partially, depending on the demands of an individual case.

First Sensor packages components in hermetic housings of different design. The form and type of housing is dependent on the size of the die, the required pin count and the power dissipation. To ensure the highest level of reliability, only inorganic materials are used for the assembly of the die and a defined dew point is guaranteed. Depending on the product, First Sensor demonstrates the reliability of its products by screening and qualification.

• Construction and design of multifunctional plastic packages based on injection molding
• Standard and special enclosures with freely selectable pinout
• Enclosures made from metal, metal/ceramics or ceramics
• Hermetic circuit sealing of metal enclosures by seam welding, resistance welding and laser welding
• Roll seam welding of rectangular or round flat packages
• Hermetic circuit sealing of ceramic enclosures by soldering
• Planar encapsulation (transparent or colored) and/or passivation of semiconductor chips in microsystems
• Cavity fill (Dam & Fill) planar encapsulation
• Glob Top (drop encapsulation with very viscous material)
• Conformal coating
• Parylene coating
• Hermetic connection of optical fibers
• Placing of frame-glass combinations
• Covering with special components (e. g. mirrors, lens systems)