The use of ceramic printed circuit boards offers many advantages over conventional electronic printed circuit boards (PCB).
The thermal conductivity of ceramics is far superior to that of PCBs:
Ceramic carriers are often packaged with bare dice (pure silicon semiconductors without housing). Silicon and thick-film ceramics follow similar thermal expansion (CTE) patterns. This, in turn, means a longer service life in particular for high thermal requirements and thermal cycling.
For use with open semiconductors, they are contacted on the ceramic (or PCB) by wire bonding. For use with encapsulated Surface-Mounted Device (SMD) components, this wire bonding is already implemented in the semiconductor component. Using open semiconductors halves the number of contact points, thereby making the circuit more reliable.Technical parameters
We offer additional substrate materials as well, e. g. different strengths of steel.
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